With Christmas a little over two weeks ago, one might be scrambling to find a gift for a loved one, friend, or family member. If you’re familiar with Arduino or Raspberry Pi and have a free weekend, ...

Connecting the dots: When Qualcomm announced its acquisition of Arduino in October, the move was met with lukewarm enthusiasm. Since then, the UK chip designer has ...

Some members of the maker community are distraught about Arduino’s new terms of service (ToS), saying that the added rules put the company’s open source DNA at ...

Why a self-contained “LED effects” manager may be a good system-wide design option. The many actions that this LED driver can initiate while offloading the processor. How a new evaluation module helps ...

What causes low yield in wafers? Usually it’s due to design or process changes, but sometimes yield issues occur even if there haven’t been any changes from one manufacturing lot to the next. Finding ...

New releases include next-generation enterprise MCP gateway solution in Kong's newest AI Gateway, MCP-enabled Developer Portal, and the Volcano SDK for agent development SAN FRANCISCO, Oct. 14, 2025 ...

Smartphone processor and modem maker Qualcomm is acquiring Arduino, the Italian company known mainly for its open source ecosystem of microcontrollers and the software that makes them function. In its ...

Amazon has unveiled its new Blink 2K cameras, including the Outdoor 2K Plus, Mini 2K Plus, and the Arc mount for panoramic coverage. With pricing starting at just $50, the lineup delivers sharp 2K ...

Accurately estimating the junction temperature of a semiconductor device is essential for ensuring its reliability, performance, and longevity. Junction temperature has a direct influence on the ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Businesses are overwhelmingly relying on Anthropic’s artificial intelligence software to automate rather than collaborate on work, according to a new report from the OpenAI rival, adding to the risk ...

To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established the "3DIC ...