IEEE

Design Considerations for LLM Inference in Data Centers: Chip and Interconnect

Abstract: This paper presents a cost-efficient chip prototype optimized for large language model (LLM) inference. We identify four key specifications – computational FLOPs (flops), memory bandwidth ...
IEEE

An Experimental Study on a Barrier-Less Cu Interconnect Scheme With Polyimide Insulator for Cost-Effective 3-D Packaging

Abstract: Polyimide (PI) has been widely used as the insulator material in the Cu interconnect system for 3-D advanced packaging. In general, a barrier layer is required between PI and Cu to suppress ...