Vadzo Imaging Unveils World’s First 13MP Autofocus USB 3.2 Gen 2×2 Camera for High-Speed Industrial Imaging

Ultra Fast 20Gbps USB 3.2 Gen 2×2 Camera Type C | Onsemi AR1335 Color Camera | ROI Based Autofocus and Auto Exposure | ...
IEEE

Defect Detection in Patterned Wafers Using Dynamic Local Adaptive Sensitivity Adjustment

Abstract: In the defect detection of patterned wafers, optical images captured by inspection systems are affected by various noises, resulting in low signal-to-noise ratios in the obtained images, ...
Detroit Free Press

Vadzo Imaging Launches Next-Generation 20MP Monochrome USB 3.2 Gen 2×2 UVC Camera Based on Onsemi Hyperlux™ LP AR2020

Powered by Infineon FX20 and Onsemi HyperLux AR2020, Vajra-2020MRS streams uncompressed 20 MP over USB-C, delivering low-latency 5K-class imaging on native UVC without PCIe frame grabbers.” — Ashu ...
Semiconductor Engineering

Catching Critical Defects In TSVs And Stacked Chips

Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...
IEEE

UnfoldDet: Advancing Surface Defect Detection with Dual Feature Separation and Relation Reasoning

Abstract: Surface Defect Detection (SDD) aims to accurately localize defects based on predefined category labels in industrial manufacturing. Different from generic object detection, the industrial ...