Abstract: This study aims to explore the solder fatigue lifetime of a developed high-voltage (1.7 kV/100 A) SiC power MOSFET module for on-board chargers (OBCs) subjected to power cycling test (PCT) ...
Abstract: A 3-D integrated packaging method is proposed in this letter. Redistributed layers (RDLs) are realized by integrating flexible printed circuit boards (PCBs) onto gallium nitride (GaN) ...
With automated proof-checkers, a problem can be broken up into small chunks, solved bit-by-bit, then reassembled with confidence that every piece is correct. For some, this heralds a new area in ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results