Abstract: In a chiplet design, several dies are integrated through die-to-die interconnects. Technical challenges still exist when it comes to the repair of faulty die-to-die interconnects to boost ...
Abstract: This paper presents the design and analysis of three microstrip graphene-based patch antennas, each utilizing a different substrate material which are Taconic TLY -3, Teflon (PTFE) and ...
Superconducting quantum design has called for specialised expertise working with mostly improvised design tools within a homegrown workflow ...
Spectacles included live coding app creation on stage, and AI-driven image generation in response to the live movement of dance ...
SCOTTSDALE, AZ, UNITED STATES, February 6, 2026 /EINPresswire.com/ -- Finesse Custom Homes has launched as the luxury ...
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