📣 Update details for version 1.3.0 📣 Please reinstall PySSA if your current version is 1.2.0 or older! Version 1.3.0 fixes the bug that every structure ...
Abstract: The parasitic inductance and dynamic current sharing performances of multichip silicon carbide power module packaging limit the device's performance. Moreover, high electrical properties ...
This was originally used internally inside of Molecular Nodes but was broken out into a separate python module for re-use in other projects. This is a convenience class that wraps around the bpy.types ...
Abstract: The semiconductor industry has adopted heterogeneous integration (HI), incorporating modular intellectual property (IP) blocks (chiplets) into a unified system-in-package (SiP) to overcome ...