IEEE

Laser Assisted Bonding (LAB) Based Flip-Chip Process for Fine Pitch Solder Bumps Device Using Laser Non-Conductive Paste (NCP)

Abstract: Non-Conductive Paste (NCP) or Non-Conductive Film (NCF) materials are thermosetting materials commonly employed to establish electrical interconnection between the bumps on the upper ...
IEEE

Accelerating Research and Development Processes Through In-House Pre-Compliance Testing Using In-Lab Constructed Setups

Abstract: This paper explores strategies for accelerating the research and development (R&D) process through in-house pre-compliance testing in a dedicated laboratory. The focus is on conducting ...
Pharmaceutical Technology

Takeda and Iambic announce $1.7bn deal to advance small molecule programmes

Through this arrangement, Takeda will gain access to NeuralPLexer, Iambic’s model for predicting protein-ligand complexes. Credit: Veroniksha / Shutterstock.com. Takeda has entered a multi-year ...
IFLScience

Student Creates "Cosmic Dust" In The Lab Using Gas And 10,000 Volts Of Electricity

James is a published author with multiple pop-history and science books to his name. He specializes in history, space, strange science, and anything out of the ordinary.View full profile James is a ...
BMJ

Systematic review and meta-analysis of the non-specific and broader impact of respiratory vaccines on acute lower respiratory infections in young children

Objectives Growing evidence suggests that vaccines targeting respiratory pathogens have non-specific and broader effects. We aimed to investigate the non-specific effects of respiratory vaccines on ...