Abstract: Digital computing-in-memory (DCIM) systems integrate complex digital logic with parasitic-sensitive bitcell arrays. Conventional physical design strategies degrade DCIM performance due to a ...
Wire-Bonding Finger Placement for FBGA Substrate Layout Design with Finger Orientation Consideration
Abstract: Wire bonding is a mature packaging technique that enables chip pins to transmit signals to bonding fingers on the substrate through bonding wires. Such commodity technology is also essential ...
A Flutter FFI plugin for OCR (Optical Character Recognition) with Edge AI support. Runs AI inference directly on mobile devices using ONNX Runtime and native OCR engines.
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