Abstract: In this article, reliability analysis of 3D CSP micro-electro mechanical system (MEMS) and IC under thermal cycle-impact coupled multiphysics loads was investigated. COMSOL Multiphysics, a ...
Abstract: This paper presents the study on the performance of High-Density Polyethylene (HDPE) as cable insulating materials containing manufacturing defects. In the present work, the effects of voids ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results