IEEE

4-Layer Wafer on Wafer Stacking Demonstration with Face to Face/Face to Back Stacked Flexibility Using Hybrid Bond/TSV-Middle for Various 3D Integration

Abstract: Different from Chip on Wafer stacking technology, Wafer on Wafer (WoW) stacking can provide a tighter pitch and higher interconnect density with higher through-put. The difficulty for WoW ...
IEEE

Miniaturized 7–12 GHz 1-to-4 Differential Power Splitter With Low Amplitude/Phase Imbalances Using Broadside-Coupled CPW/SIDGS Scheme and Embedded CPW Spur-Line

Abstract: In this paper, a compact 7–12 GHz 1-to-4 differential power splitter is proposed using the broadside-coupled coplanar waveguide (CPW) and substrate-integrated defected ground structure ...