Vadzo Imaging Unveils World’s First 13MP Autofocus USB 3.2 Gen 2×2 Camera for High-Speed Industrial Imaging

Ultra Fast 20Gbps USB 3.2 Gen 2×2 Camera Type C | Onsemi AR1335 Color Camera | ROI Based Autofocus and Auto Exposure | ...
AZoM on MSN

Imaging silicon defects using Raman and PL multivariate imaging

PCA and K-means clustering applied to Raman and PL imaging reveal structural defects in silicon wafers, enhancing understanding of optoelectronic performance.
IEEE

Defect Detection in Patterned Wafers Using Dynamic Local Adaptive Sensitivity Adjustment

Abstract: In the defect detection of patterned wafers, optical images captured by inspection systems are affected by various noises, resulting in low signal-to-noise ratios in the obtained images, ...
Semiconductor Engineering

Catching Critical Defects In TSVs And Stacked Chips

Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...
IEEE

UnfoldDet: Advancing Surface Defect Detection with Dual Feature Separation and Relation Reasoning

Abstract: Surface Defect Detection (SDD) aims to accurately localize defects based on predefined category labels in industrial manufacturing. Different from generic object detection, the industrial ...