This week's Java roundup for January 26th, 2026, features news highlighting: an update on milestone and GA release schedule ...
Abstract: Indium (In) is the widely adopted solder thermal interface materials (TIM1) for high-power central processing unit (CPU) chips, primarily because it offers improved heat dissipation ...
Abstract: The problem of multiagent encirclement with multiobstacle collision avoidance (EMOCA) has been challenging since it is difficult to balance the tradeoff between surrounding a mobile target ...
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