Imec and Sony have developed a novel integration module for highly dense backside interconnects – key components of 3D stacking and backside functionalisation technologies. The module is structured ...
This tutorial explains how to perform handovers. It covers both F1 handovers (intra-gNB, within a single gNB between DUs) and N2 handovers (inter-gNB). This document assumes familiarity with the F1 ...
Microsoft Azure IoT Hub provides out-of-the-box capabilities to send device-to-cloud messages directly into Azure for advanced logging/routing and generating actions based on events occurring on the ...
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