A new technical paper titled “Design and Implementation of Test Infrastructure for Higher Parallel Wafer Level Testing of System-on-Chip” was published by researchers at Inha University and Teradyne. ...

Parallel piezo aligners with fly height sensors enable faster PIC wafer testing. SAN FRANCISCO, Jan. 21, 2026 /PRNewswire/ -- PI (Physik Instrumente) announced a new technology platform for ...

GRENOBLE, France--(BUSINESS WIRE)--Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced a significant order from a tier-1 semiconductor ...

The world’s fastest automated photonic alignment with nine-axis nano-precision, delivering significantly higher throughput compared to other technologies. Full integration of FormFactor’s Velox™ probe ...

FREMONT, Calif., Oct. 06, 2022 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and reliability qualification equipment, today announced it has released ...

As a partner for the semiconductor equipment industry, as well as test providers and users, Jenoptik is offering a novel optical solution for integration into electrical test cards. The ultra-fast ...

ficonTEC’s new WaferLine Test (WLT) product line is specially designed as a versatile, fully automatable test-&-measurement system platform for wafer-level device test. They systems provide fully ...

The continuing advances in semiconductor functionality, density, and chip-level integration are generating new challenges in accessing devices for test and controlling the physical and electrical ...

Considered something of a necessary evil, burn-in of IC packages during production does a great job of weeding out latent defects so they don’t turn into failures in the field. But as AI and ...

Parallel piezo aligners with fly height sensors enable faster PIC wafer testing. Parallel miniaturized piezoelectric alignment engines with fly-height sensors enable faster PIC wafer testing. Image ...