EDN

SystemC, transaction level modeling simplifies capture

IP companies have heralded a new age in platform-based design for years – ever since semiconductor integration capacity reached the point where entire systems could theoretically be integrated into a ...
Design-Reuse

Open SystemC Initiative Advances IP Interoperability and Reuse with New Draft Standard for Transaction-Level Modeling

SystemC users urged to provide feedback on TLM-2 Draft 2 by January 31st SAN JOSE, Calif. December 4, 2007 The Open SystemC Initiative (OSCI), an independent non-profit organization dedicated to ...
Design-Reuse

The Open SystemC Initiative Announces Availability of the SystemC Transaction-level Modeling Standard with Broad Industry Support

SAN JOSE, Calif.--(BUSINESS WIRE)--June 6, 2005--The Open SystemC Initiative (OSCI) today announced the delivery of the SystemC(TM) Transaction-level Modeling (TLM) Standard 1.0. The availability of a ...
EDN

The ‘what’ and ‘why’ of transaction level modeling

Advances in both the physical properties of chips and in design tools allow us build huge systems into “just a few” square millimeters. The problem is that modeling these systems at the ...
Business Wire

IEEE Approves Revised IEEE 1666™ “SystemC Language” Standard for Electronic System-Level Design, Adding Support for Transaction-level Modeling

PISCATAWAY, N.J.--(BUSINESS WIRE)--IEEE, the world's largest professional association advancing technology for humanity, today announced that the IEEE Standards Association (IEEE-SA) Standards Board ...