Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

When designing electronics, heat dissipated to the surroundings by micro devices is an important consideration because heat has a powerful and stringent effect on their operation and lifespan. When an ...

In a previous article, “A Close Look at Facts and Myths About Thermal Vias,” we used a thermal simulation model called Thermal Risk Management, or TRM, to model thermal vias. Thermal vias, almost by ...

It’s costly and time-consuming to determine the causes of hotspots on circuit boards, and to attempt to arrive at a “well-tempered” board through multiple iterations once a prototype is approved. A ...