Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, ...

TL;DR: SK hynix CEO Kwak Noh-Jung unveiled the "Full Stack AI Memory Creator" vision at the SK AI Summit 2025, emphasizing collaboration to overcome AI memory challenges. SK hynix aims to lead AI ...

The fifth generation of High Bandwidth Memory is currently in use as HBM3E. After SK Hynix delivered samples of the upcoming HBM4 generation with 12 layers of 24 Gbit each back in March, mass ...

As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...

JEDEC is still finalizing the HBM4 memory specifications, with Rambus teasing its next-gen HBM4 memory controller that will be prepared for next-gen AI and data center markets, continuing to expand ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

Microsoft announced today a new security feature for the Windows operating system. Named "Hardware-enforced Stack Protection," this feature allows applications to use the local CPU hardware to protect ...

IBM's so-called 3D-chip technology is set to be used in next-generation memory processors from Micron Technology, yielding very-high-speed DRAM. Brooke Crothers writes about mobile computer systems, ...