TL;DR: SK hynix CEO Kwak Noh-Jung unveiled the "Full Stack AI Memory Creator" vision at the SK AI Summit 2025, emphasizing collaboration to overcome AI memory challenges. SK hynix aims to lead AI ...
TL;DR: SK hynix will showcase its AI memory technologies at CES 2025, featuring solutions for on-device AI and next-generation AI memories. The company aims to highlight its technological ...
Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, ...
The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum) recently wrapped up in Shenzhen. Themed "AI Applications, Innovation Empowered, "GMIF2025 represented as a gathering of leading ...
At the SK AI Summit 2025 in Seoul on November 3, 2025, SK Hynix CEO Kwak Noh-jung announced a major strategic overhaul, revealing plans to transform the South Korean memory maker from a traditional ...
SAN JOSE, Calif.--(BUSINESS WIRE)--KIOXIA America, Inc. today announced that its KIOXIA LC9 Series 245.76 terabyte (TB) 1 enterprise SSD, utilizing a 32-die stack KIOXIA BiCS FLASH™ generation 8 QLC ...
High bandwidth memory (HBM) chips have become a game changer in artificial intelligence (AI) applications by efficiently handling complex algorithms with high memory requirements. They became a major ...
Micron has announced it's now shipping its fastest and highest-capacity high-bandwidth memory (HBM) yet, its second-generation HBM3, called HBM3e. The company's newest memory modules feature a record ...
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