Ironwood Electronics has released a new test socket for BGA devices; it features a clamshell lid design for ease of chip replacement in the production environment. Besides final production test, the ...
As semiconductor devices continue to advance, the demand for reliable, high-performance test sockets has never been greater. Yet, traditional socket design validation methods—such as per-pin ...
Ironwood Electronics has released a new socket for testing BGA devices like DDR4 memory chips. The SBT-BGA-7051 test socket features a floating guide for precise ball-to-pin alignment. Simply place ...
WinWay Technology, a Taiwan-based provider of semiconductor test interface solutions, has emerged as the world's largest supplier of test sockets, riding the wave of accelerating demand for ...
Ironwood Electronics introduced a new high-performance elastomer socket for 0.5-mm-pitch ball-grid-array (BGA) packages. The CG15-BGA-1003 socket is designed for a 10- x 5.7-mm package size. It ...
Ironwood Electronics recently introduced a new QFN socket design using high performance elastomer capable of 60+ GHz, very low inductance for ATE applications. The GTP-QFN-1001 socket is designed for ...
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