Delay-inducing defects are causing increasing concern in the semiconductor industry today, particularly at the leading-edge 130- and 90- nanometer nodes. To effectively test for such defects, the ...
When semiconductor devices had geometries of 0.18 microns and larger, most defects manifested themselves as static faults. Test strategies based on stuck-at fault-model scan patterns and standard ...
Despite its standardization as IEEE 1149.1 in 1990 and wide use in the industry, many test engineers and developers still do not fully understand the benefits of boundary scan test. The misconceptions ...
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