The University of Arkansas has received a $3.5 million grant to upgrade its High-Density Electronics Center and become a Power Packaging ...
Technology announces the launch of the MCPF1525 Power Module, a highly integrated device with a 16V Vin buck converter that ...
The federal award enables the High Density Electronics Center to upgrade its equipment and capabilities while conferring status as a Power Packaging Center of Excellence.
The increasing AI and high-performance computing workloads demand power solutions that combine efficiency, reliability and ...
GaN-, and silicon-based power transistors, modules, and other basic building blocks for more robust, efficient, and ...
Enabling higher power within the same rack space, Microchip’s MCPF1525 power module delivers up to 25 A per device, stackable ...
Enables automotive OEMs and power converter designers to accelerate the time to market for discrete devices and power modules SANTA ROSA, Calif.--(BUSINESS WIRE)--Keysight Technologies, Inc. (NYSE: ...
As efforts to protect the environment have advanced, the use of inverters in industrial applications and green energy systems have continued to grow rapidly as a way to achieve low-power motor control ...
Microchip’s MCPF1525 power module with PMBus™ delivers 25A DC-DC power, stackable up to 200ACHANDLER, Ariz., Feb. 03, 2026 ...
The MSK3004 is an H-bridge MOSFET power module available in a space efficient isolated ceramic tab power SIP package. This device contains P-channel MOSFETS for the top transistors and N-channel ...
TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will invest approximately 10 billion yen to construct a new facility for the assembly and inspection of ...
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