Parallel test is used for nearly every device produced by fabs and OSATs, but it can reduce yield and increase the cost of test boards and operations. This is a well-understood tradeoff for ensuring ...

Testing multiple devices at the same time is not providing the equivalent reduction in overall test time due to a combination of test execution issues, the complexity of the devices being tested, and ...

FormFactor (www.formfactor.com) has introduced a test platform for automotive devices that can reduce wire bond or system-on-chip device pad pitch as low as 60µm, increase the number of die tested in ...