Start working toward program admission and requirements right away. Work you complete in the non-credit experience will transfer to the for-credit experience when you ...
Recent advances in electronic equipment demand more compact, lighter and functionally superior components. Die-bonding film is widely used in semiconductor packaging in electronic equipment such as ...
This paper addresses the issue of which strong duality holds between parametric robust semi-definite linear optimization problems and their dual programs. In the case of a spectral norm uncertainty ...
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