Chemists from the National University of Singapore (NUS) have successfully imaged the dynamic assembly of bilayer covalent organic frameworks (COFs) in solution, providing new insights into controlled ...
Transferable Hybrid Bonding Technique That Allows For High Integration Density In Advanced Packaging
A technical paper titled “Hierarchical Multi-Layer and Stacking Vias with Novel Structure by Transferrable Cu/Polymer Hybrid Bonding for High Speed Digital Applications” was published by researchers ...
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