Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...

TORONTO, Dec. 17, 2020 (GLOBE NEWSWIRE) -- POET Technologies Inc. (“POET” or the “Company”) (TSX Venture: PTK; OTCQX: POETF) the designer and developer of the POET Optical Interposer™ and Photonic ...

It seems that Samsung Foundry has finally managed to stabilize its 3nm GAA chip production process. The company was struggling with it for a long time, even preventing the implementation of the Exynos ...

Samsung is reportedly collaborating with Qualcomm to develop a customized version of the Snapdragon 8 Elite Gen 5 chip, using Samsung’s advanced 2-nanometer SF2 process. This partnership aims to ...