Smart phones are a rapidly growing share of mobile phone shipments, representing 15% of the market in 2009 and growing to 35% in 2013. Essentially all the growth in mobile phone sales will come from ...
Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...
Page 1: Touring Intel’s Malaysia Chip Packing Facilities: Die Sort Die Prep Assembling Chips With Advanced Packaging Techniques Advanced Packaging process overview From there, reels are sent to ...
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