Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

You know, electronics are getting wild these days. Everything’s supposed to be smaller, faster, and just generally ...

Smart phones are a rapidly growing share of mobile phone shipments, representing 15% of the market in 2009 and growing to 35% in 2013. Essentially all the growth in mobile phone sales will come from ...

TORONTO, Dec. 17, 2020 (GLOBE NEWSWIRE) -- POET Technologies Inc. (“POET” or the “Company”) (TSX Venture: PTK; OTCQX: POETF) the designer and developer of the POET Optical Interposer™ and Photonic ...

So, you’ve probably heard about flip chip IC technology, maybe in passing or maybe you’re knee-deep in a project that needs it. It’s this pretty neat way of putting computer chips onto circuit boards.