Vishay Intertechnology, Inc. announced the availability of its improved dual-in-line thin film resistor networks providing improved ESD and moisture protections in a compact 8-pin SOIC packages. The ...
Intel's first socketed microprocessors came in a dual in-line package (DIP) with 40 connectors. The i486 used a variety of sockets, but the most popular had 237 contacts. AMD's "Socket A" for the ...
A new dual-in-line package intelligent power module (DIP IPM) is claimed as a low-cost integrated solution for small inverters. It consists of a three-phase IGBT bridge with associated free-wheel ...
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