Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

Smaller PCBs, including rigid-flex circuits, call for die attach using one of three methodologies, depending on the application Technologies that for years were the sole domain of semiconductor ...

QPT just filed a patent for the “qAttach” process, a novel way to attach dies to heat spreaders or substrates (typically aluminum nitride (AlN)) that significantly reduces thermal resistance. The new ...

Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...

The power electronics industry is facing a problem in that, as the power handled by transistors increases to meet the needs of new applications, the packaging will increasingly struggle to remove the ...

Fundamental materials properties of the plated layer (such as purity and microstructure) are critical for die attach and wirebond, and the specific plating strategies that can yield these properties.

Venkat Nandivada, Manager of Technical Support at Master Bond Inc, talks to AZoM about die attach adhesives used in semiconductor assembly. Beyond their ability to form a tight bond between die and ...