Siemens today announced it has acquired ASTER Technologies ("ASTER"), a privately held market leader in printed circuit board ...

The impact of materials on designing reliable devices. How packaging plays an important role in SiC MOSFET design. Determining the FIT rate for SiC MOSFETs. There’s no doubt that the material ...

MUNICH--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS) today introduced the Cadence ® Legato™ Reliability Solution, the industry’s first software product that meets the challenges of ...

The JEDEC 35 Standard (EIA/JESD35, Procedure for Wafer-Level Testing of Thin Dielectrics) describes voltage ramp (V-ramp) and current ramp (J-ramp) tests to monitor oxide integrity. These tests are ...

Collaboration enables SoC manufacturers to improve their qualification envelope to achieve lifetime reliability, shorten their root cause analysis time, and reduce operational costs HAIFA, ...

With today’s powerful computational resources, digital design is increasingly used earlier in the design cycle to predict zero-hour nominal performance and to assess reliability. The methodology ...

For decades, megaprojects in every industry have been designed to provide specific functionality or value with delivery and commissioning as the end goal. Large process and refinery projects, such as ...

The rapid transition in the upstream manufacturing solar sector to significantly larger p-type and n-type monocrystalline wafers, cells and modules may be hailed a new era for the industry in higher ...

http://www.maxwell.comSystem reliability concerns are imperative to the implementation of today's broadband wireless infrastructure. Wireless networks require new ...

Using computer models to simulate product behavior was first used mainly to replace hardware prototyping to assess design performance at the end of the development cycle. However, with increasingly ...

[This article was first published in Army Sustainment Professional Bulletin, which was then called Army Logistician, volume 1, number 2 (November–December 1969), pages 8–11, 24–25.] “… in the process ...