Programmable material systems are emerging architectural structures but the co-design of structure, material, and external stimuli present grand challenges. A team with Northwestern Engineering’s Wei ...

This review proposes to achieve the targeted development and fabrication of high-performance high-temperature electromagnetic shielding ceramics through microstructural engineering, additive ...

PhysicsX’s LGM-Aero AI-based analysis tool predicts performance of new shapes. Credit: PhysicsX Numerical simulation has become an essential part of aircraft design, from aerodynamics and structures ...

The implementation flow for semiconductor devices is all about optimizing for power, performance, area (PPA), or some combination of these attributes. The history of this flow in electronic design ...

Optical metasurfaces, with their ultra-thin and lightweight properties, are driving the miniaturization and planarization of optical systems. However, their development from unit-cell design to system ...

Cadence launches AuraStack AI Super Agent on Allegro AI Studio platform to automate PCB and advanced packaging design ...

As semiconductor components continue to shrink, the challenges associated with design-for-manufacturing (DFM) and design-technology co-optimization (DTCO) increase. The complexity of the IC design and ...