Power Tips #154: Finding the thermal and current limits of high-power GaN devices through simulation
High power density power-supply modules based on gallium nitride (GaN) devices are core components in the automotive, industrial and data-center sectors. As their integration level and power density ...
Copper (Cu) redistribution layer (RDL) technology is used to interconnect chips in various high current Wafer Level Packaging (WLP) applications. Typically, Cu RDLs with thicknesses of 5-9 µm and ...
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