WeiHsun is a guest author and Deputy Manager, Core Methodology Department, at Global Unichip Corp. In the rapidly evolving world of ASIC design, the shift from monolithic to 2.5D and 3D multi-die ...
Unique platform delivers automation and visualization for 2.5D/3D package design and implementation, with power, thermal, and noise-aware optimization MOUNTAIN VIEW, Calif., April 28, 2020-- Synopsys, ...
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