At this year’s Pack Expo International, Bosch Packaging Technology debuted several secondary packaging technologies. The solutions aim to provide flexibility and quick changeovers, improved ergonomics ...

At Interpack 2014, Bosch Packaging Technology will showcase a number of highly flexible solutions enabling quick changeovers of pack styles, sizes and products. Bosch’s flexible solutions are designed ...

Bosch Packaging Technology, a leading supplier of processing and packaging solutions, will feature several technologies from its secondary packaging portfolio At PACK EXPO International 2014 in ...

The demand for sustainable packaging among consumers and brand owners all over the world is growing at an exponential rate, which in many cases drives a strong need to replace plastic packaging.

At PACK EXPO International 2014, Bosch Packaging Technology will feature several technologies from its secondary packaging portfolio. The show will mark the North American debut of the Sigpack TTMC ...