A new type of 3D-printed adhesive could change how we join materials together. So far, scientists have developed two new methods that can create extremely strong bonds at the pore level, eliminating ...

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...

The redistribution layer metal process converts wire bond pads at the perimeter of the die to an array of bump pads that are relocated to the center area of the die. The relocation of pads allows for ...

Advantages of silicone optical bonding materials. How various processing options influence bonding techniques and curing mechanisms. From cars, smartphones, and wearables to digital signage, ...

A review of the use of adhesives for device assembly, focusing on optical radiation curing using UV light. by B. G. Yacobi, Chris Le Conte, Kevin Davis, and Manfred Hubert New equipment, such as the ...

Flip-chip bonding is the process of bonding on-chip electrodes to printed circuit board (PCB) electrodes using Au bumps. The bond strength influences the circuit’s conductivity directly, without the ...

NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is ...

Unable to scale horizontally, due to a combination of lithography delays and power constraints, manufacturers are stacking devices vertically. This has become essential as the proliferation of mobile ...

Injection-molded liquid silicone rubber (LSR) is used in the manufacture of many goods, from medical devices to cookware to electronics. Many LSR applications require that the silicone be bonded to ...