Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.
PHOENIX--(BUSINESS WIRE)--Spirit Electronics, a value-added microelectronics distributor, is rolling out additional capacity for its automated BGA reballing service. Spirit’s high-efficiency ...
This application note provides guidelines for board mounting of surface mount semiconductor packages. Reflow soldering is a widely spread technology for soldering of surface mount semiconductor ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback