Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...
Integration of Dyndrite LPBF Pro gives users direct vector-level control of laser speeds and feeds, making Velo3D systems a premier platform for AM research and production. FREMONT, Calif., Oct. 1, ...
As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...
Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...
Advanced packaging options continue to stack up in the pursuit of “More than Moore” and higher levels of integration. It has become a place where many high-density interconnects converge, and where ...
Heterogeneous integration and system-level integration seen as 'next step' in advanced packaging era
With TSMC's CoWoS and the 2.5D advanced packaging from OSAT companies becoming a hot topic due to capacity shortages, advanced packaging solutions are seen as the next big thing. Save my User ID and ...
Heterogeneous integration technology refers to the integration of separately manufactured components into a higher-level assembly, or system in package (SiP), that in the aggregate, provides enhanced ...
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