Electronic Design

Seeing the Unseen in 3D-Stacked Semiconductors

In this Q&A, you will learn about some of the technologies and techniques that are making it possible to address advanced ...
TweakTown

TSMC's new advanced packaging plant in Taiwan gets hit by typhoon after recent delays

TL;DR: TSMC's advanced packaging plant in Chiayi, Taiwan, faced multiple setbacks, including typhoon damage from Typhoon Danas-the first to hit Chiayi in 120 years-causing scaffolding collapse and ...
Semiconductor Engineering

Tackling Advanced Chip Manufacturing Challenges

Intel and PDF Solutions are deepening their partnership to address the growing complexity of semiconductor manufacturing at advanced nodes, according to a recent discussion between Intel CEO Lip-Bu ...
Morningstar

Lam Research Introduces VECTOR® TEOS 3D to Address Critical Advanced Packaging Challenges in Chipmaking

Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures "VECTOR TEOS 3D deposits the ...
Semiconductor Engineering

Leveraging NEMS To Address Critical Hardware Security Challenges In Advanced Packaging (U. of Florida)

A new technical paper titled “Nanoelectromechanical Systems (NEMS) for Hardware Security in Advanced Packaging” was published by researchers at University of Florida. “As hardware security threats ...