A new technical paper titled “Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation ...

SK Hynix will invest 19 trillion won in a new advanced chip packaging facility in Cheongju to boost capacity for AI-driven ...

In recent days, Amkor Technology has drawn attention as analysts highlighted its role in supplying advanced semiconductor packaging and test services for fast-growing AI-focused chips, including CPUs, ...

The integration of multiple heterogeneous dies in a package is pivotal for extending Moore’s Law and enhancing performance, power efficiency, and functionality, but it also is raising significant ...

EPIC Advanced Packaging marks an expansion of Applied’s global innovation platform Company convenes top semiconductor R&D leaders to advance high-performance, low-power AI chip packaging technologies ...

PTAG to acquire Construct-X, uniting leaders in AWP and digital project delivery to transform industrial capital projects through innovation and collaboration. PTAG and Construct-X, bringing together ...

GlobalFoundries has signed a Memorandum of Understanding with Singapore's Agency for Science, Technology and Research (A*STAR) to enhance its advanced packaging capabilities in response to the growing ...

The U.S. Department of Commerce today announced the launch of a new federal funding competition that aims to spur the research and development of more advanced computer chip packaging technologies.

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

Every Wednesday and Friday, TechNode’s Briefing newsletter delivers a roundup of the most important news in China tech, straight to your inbox. Sign up Traditionally, packaging has been considered a ...

GlobalFoundries plans a new advanced packaging center in New York for U.S.-made semiconductor chips, supported by state and federal funding. GlobalFoundries has announced plans to establish a new ...

TL;DR: TSMC's advanced packaging plant in Chiayi, Taiwan, faced multiple setbacks, including typhoon damage from Typhoon Danas-the first to hit Chiayi in 120 years-causing scaffolding collapse and ...