In a new review article publication from Opto-Electronic Advances, Yingtao Hu, Di Liang and, Raymond G. Beausoleil from Hewlett Packard Labs discuss advanced III-V-on-silicon photonic integration.

‘All of these things are really opportunities for people like us who are problem solvers to figure out how do we bridge the challenge of adopting technology, enabling technology inside your enterprise ...

Held in Guangzhou from December 11, the 2025 Global Technology Innovation Conference (TIC) served as the flagship stage for ...

ADVANCED INTEGRATION TECHNOLOGY was selected by Boom Supersonic to supply tooling/automation, including transportation and positioning tools for fuselage assembly, wing assembly, wing-to-fuselage ...

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...

In the competitive landscape of modern business, efficiency and collaboration are essential. Advanced workflow integration is transforming how enterprises function by breaking down barriers between ...

WINTER SPRINGS, Fla.--(BUSINESS WIRE)--Advanced IT Concepts (AITC), Inc., a leading systems integration firm providing Information Technology (IT), Training, Simulation and professional services and ...

In recent years, advanced packaging has become much more important. While semiconductor manufacturers used to focus primarily on miniaturization and increasing the performance of individual chips, the ...