Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...
Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and IoT. Recently developed 2.5 and 3D-IC silicon-based packaging ...
Meshy, a startup in the AI design space, released Meshy-4 today, its latest AI-powered 3D modeling tool. The new version offers improved mesh geometry and a redesigned workflow, aiming to change how ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback