The mainstream adoption of 3D-IC has become a question mark due to critical challenges ranging from early-stage chip designs to 3D assembly exploration to final design signoff. A new EDA tool claims ...

3D Visualization Lecturers: 3D Visualization professionals are invited to RIT to lead lectures, discussions, and demos that give you an informed industry perspective. Industry Networking: Take part in ...

Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...

Join members of the development team for a look at Operencia from a Design and 3D level building perspective as they discuss how a level comes to life, and more. Operencia: The Stolen Sun will be ...

Have you ever spent hours perfecting a 3D-printed design, only to struggle with attaching screws or bolts securely? It’s a frustrating experience that many makers and engineers face. Threads are ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven ...