In recent years, computer chip performance has bumped up against the physical limitations of the space available on integrated circuits.

As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ...

Subscribe to our newsletter for the latest sci-tech news updates. Through new research published in Nature, Qing Cao and colleagues at the University of Illinois Urbana-Champaign have developed a new ...

Researchers at Stanford, MIT, and other universities unveiled a new, monolithic 3D processor that could help solve one of the biggest problems facing chipmakers: the processor-memory performance gap.

Summary: Researchers introduced the world’s first chip capable of matching the operational speed of the human brain. Fabricated using a standard 40-nanometer process, the sub-10-millisecond neural ...

Artificial intelligence computing startup D-Matrix Corp. said today it has developed a new implementation of 3D dynamic random-access memory technology that promises to accelerate inference workloads ...

The Albany NanoTech complex, operated by NY Creates, is going to be home to a new chip lithography center funded by more than $2 billion in state and federal grants. The center is key to the ...

Researchers developed a dual-modulated vertical transistor that suppresses leakage at nanoscale channels and supports scalable 3D semiconductor integration. (Nanowerk News) Researchers at the Daegu ...

Imec and Sony Semiconductor Solutions Corporation (Sony) have jointly presented a new integration method for connecting the front and back sides of semiconductor wafers, a step the two organizations ...