A new technical paper titled “Energy-/Carbon-Aware Evaluation and Optimization of 3D IC Architecture with Digital Compute-in-Memory Designs” was published by researchers at Cornell University. “In ...

3D NAND: Challenges Beyond 96-Layer Memory Arrays Bottlenecks in stacking memory layers and new opportunities for solutions.

I have a bunch of hard-coded global 3D arrays of floats. I can loop through an individual 3D array just fine, but I also want to loop through all the 3D arrays. So, I thought of creating a one ...

A 3D first-person problem-solving adventure game has been developed by computer scientists at the University of California, San Diego. Players in the game use the Java programming language to ...