TL;DR: Broadcom has introduced its 3.5D eXtreme Dimension System in Package (XDSiP) technology, enabling AI customers to develop advanced custom accelerators. This platform integrates over 6000 mm² of ...
Broadcom Inc. has announced the availability of its 3.5D eXtreme Dimension system-in-package (XDSiP) platform technology to develop next-generation custom AI accelerators (XPUs), claiming breakthrough ...
PALO ALTO, Calif., Dec. 05, 2024 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiPâ„¢) platform technology, ...
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